Semiconductor device and lead frame assembly/lead frame for making a semiconductor device
US6518657B2 · kind B2 · utility
1Cited by
8References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 11, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Jun 11, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/181
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor device having oppositely facing first and second sides. The semiconductor device has a support exposed at the first side of the semiconductor device, a semiconductor device mounted on the support, and a plurality of leads connected to the semiconductor device. A lead identifier on the support is visible at the first side of the semiconductor device, and assists identification of a specific lead in the plurality of leads.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.