Probe card
US6518779B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Oct 19, 1998 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Oct 19, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01R1/07314
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A probe card is used in testing an electric characteristic of plural semiconductor chips formed on a semiconductor wafer in a batch at a wafer level through application of a voltage to electrodes of the semiconductor chips. The probe card includes a card body, plural probe terminals, a wiring and a control element. The plural probe terminals are disposed on one surface of the card body in positions corresponding to the electrodes of the semiconductor chips. The wiring is disposed on the other surface of the card body and electrically connected with the probe terminals. The control element is disposed on the latter surface of the card body between the wiring and the probe terminals and controls input/output of the semiconductor chips.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.