Heat sink retention frame
US6519153B1 · kind B1 · utility
9Cited by
3References
21Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 8, 2001 |
| Grant date | Feb 11, 2003 |
| Priority date | — |
| Expiry date | Aug 8, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T24/44026
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An assembly is disclosed including a printed circuit board, a single piece heat sink retention frame secured to the printed circuit board, the frame comprising four structural members surrounding an aperture, an integrated circuit chip secured to the printed circuit board and positioned within the aperture and a heat sink secured to the frame, the heat sink positioned above the integrated circuit chip and at least partially within the aperture.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.