High planarity chemical mechanical planarization
US6520843B1 · kind B1 · utility
Assignee
Inventor
Key dates
| Filing date | Oct 26, 2000 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Dec 15, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
Specific embodiments of the present invention are directed to a chemical mechanical planarization apparatus which comprises a platen assembly for holding an object to be planarized, and a polishing pad having a surface size at least as large as a surface size of the object, the polishing pad being movable relative to the object. A table has a surface supporting the polishing pad and including a plurality of grooves forming a patterned surface. In some embodiments, the grooves form a repeated pattern on the surface of the table. The pattern may include a plurality of platelets having the same shape and size. The platelets may be hexagonal and vertically compliant. The surface of the table is harder than the polishing pad.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.