Method of fabricating a liquid crystal-on-silicon backplane
US6521475B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Dec 17, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Dec 17, 2021 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG02F1/136277
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A reflective mirror layer is formed over a silicon substrate and is then selectively etched to define a crossover pad region, a pixel array region, and a bonding pad region on the silicon substrate. A dielectric layer is deposited over the crossover pad region, the pixel array region and the bonding pad region, and a plurality of crossover pad vias are formed within the crossover pad region thereafter. By filling the crossover pad vias with conductive material, a plurality of plugs is formed in the plurality of the vias. Then, a top pad, electrically coupled to the bottom pad via the plugs, is formed over the crossover pad region. A spacer pattern on the dielectric layer within the pixel array region is defined thereafter. Finally, the dielectric layer is etched to form a plurality of spacers within the pixel array region.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.