Mold injection method for semiconductor device
US6521484B1 · kind B1 · utility
1Cited by
5References
2Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | May 5, 1999 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | May 5, 2019 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a mold injection method for semiconductor device by which the problem of residual metal is overcome. The inventive method comprises following steps: die attaching; wire bonding; attaching solder-resisting tape around the die; molding; removing the older-resisting tape; marking; ball placement: and singulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.