Process for local on-chip cooling of semiconductor devices using buried microchannels
US6521516B2 · kind B2 · utility
62Cited by
3References
22Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 2001 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Jun 29, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus comprising using buried microchannels to cool specific areas of a substrate over which high heat generating elements of integrated circuits, circuits or devices are processed is disclosed. In one embodiment of the method and apparatus comprise running a cooling fluid thorough a buried microchannel under a heat generating element to locally cool the substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.