Through hole in a photoimageable dielectric structure with wired and uncured dielectric
US6521844B1 · kind B1 · utility
16Cited by
12References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 29, 1999 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Oct 29, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49165
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
An electronic structure. The electronic structure comprises a layer. The layer includes: a cylindrical volume; a fully cured annular volume of a photoimageable dielectric (PID) material circumscribing the cylindrical volume; and a partially cured remaining volume of the PID material circumscribing the annular volume. The cylindrical volume may include a via. The structure can include a power plane.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.