Plastic integrated circuit device package and method for making the package

US6521987B1 · kind B1 · utility

Assignee

• Amkor Technology, Inc. · US

Inventors

• Thomas P. Glenn · Gilbert, US
• Scott Joseph Jewler · Gilbert, US
• David Roman · Tempe, US
• Jae Hak Yee · Shanghai, CN
• Doo Hwan Moon · Seoul, KR

Key dates

• Filing date: Oct 31, 2000
• Grant date: Feb 18, 2003
• Expiry date: Oct 31, 2020

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T29/49171
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

A package for an integrated circuit device, having a die, a die pad, leads, bond wire, and an encapsulant. The lower surfaces of the die pad and the leads are provided with stepped profiles. Structures extending from lateral sides of the leads are formed to prevent the leads from being pulled horizontally from the package. Encapsulant material fills beneath the recessed, substantially horizontal surfaces of the die pad and the leads, and thereby prevents the die pad and the leads from being pulled vertically from the package body. Other portions of the die pad and the leads are exposed within the package for connecting the package externally.