Ball limiting metallurgy for input/outputs and methods of fabrication
US6521996B1 · kind B1 · utility
46Cited by
6References
14Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 30, 2000 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Jun 30, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12556
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention is an input/output for a device and it method of fabrication. The input/output of the present invention comprises a bond pad having a ball limiting metallurgy (BLM) formed thereon and a bump formed on the ball limiting metallurgy (BLM). In an embodiment of the present invention the ball limiting metallurgy comprises a first film comprising nickel, vanadium, and nitrogen. In the second embodiment of the present invention the bump limiting metallurgy includes a first alloy film comprising a nickel-niobium alloy.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.