Combined 3D- and 2D-scanning machine-vision system and method
US6522777B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Jul 8, 1999 |
| Grant date | Feb 18, 2003 |
| Priority date | — |
| Expiry date | Jul 8, 2019 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG06V2201/06
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
Manufacturing lines include inspection systems for monitoring the quality of parts produced. Manufacturing lines for making semiconductor devices generally inspect each fabricated part. The information obtained is used to fix manufacturing problems in the semiconductor fab plant. A machine-vision system for inspecting devices includes a light source for propagating light to the device and an image detector that receives light from the device. The devices, such as semiconductors, are placed in trays for inspection at one or more inspection stations. A compartment for holding a plurality of trays is positioned near a first inspection station having a first inspection surface. An elevator elevates one of the trays from the compartment and presents the tray and the devices held by the tray to the first inspection surface. After being inspected at a first station, a tray-transfer device moves the tray from the first inspection station to a flipper mechanism. The flipper mechanism includes two jaws and a rotator. The flipper mechanism turns the devices over and places the devices in a second tray so that another surface of the device can be inspected. A second tray-transfer device moves …
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.