Low-residue, low-solder-ball flux
US6524398B2 · kind B2 · utility
6Cited by
7References
18Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 12, 2001 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Apr 18, 2021 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23K35/3618
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A soldering flux includes a solvent, an activator in the solvent, and cationic and nonionic surfactants. The soldering flux can be applied to a substrate, such as a printed circuit board before solder is applied.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.