Method, apparatus and system for building an interposer onto a semiconductor wafer using laser techniques
US6524885B2 · kind B2 · utility
59Cited by
4References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 15, 2000 |
| Grant date | Feb 25, 2003 |
| Priority date | — |
| Expiry date | Dec 30, 2020 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31511
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The present invention provides a method, apparatus and system for building a wafer-interposer assembly. The method includes the steps of forming a redistribution layer (RDL) pad on a semiconductor wafer. The semiconductor wafer has a semiconductor die and the RDL pad has an electrical connection to the semiconductor die. A layer of epoxy is placed on the semiconductor wafer and on the RDL pad. The epoxy is then leveled generally parallel to the surface of the semiconductor wafer and removed from a portion of the RDL pad. An interposer pad is formed on the RDL pad where the epoxy was removed.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.