Patent · US Expired

Molded integrated circuit package

US6525421B1 · kind B1 · utility

16Cited by

6References

5Claims

0Family size

Assignee

LSI Logic Corporation · US

Inventors

Chok J. Chia · Campbell, US
Seng-Sooi Lim · San Jose, US
Wee Liew · San Jose, US

Key dates

Filing date	May 1, 2001
Grant date	Feb 25, 2003
Priority date	—
Expiry date	May 1, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10S425/044
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A mold for use in encapsulating an integrated circuit, wherein an encapsulant is injected into the mold during packaging of the integrated circuit. The improvement to the mold is a shaped member having an abutting surface for contacting a surface of the integrated circuit and thereby substantially preventing encapsulant from adhering to the surface of the integrated circuit, whereby the surface of the integrated circuit is left exposed. Because the surface of the integrated circuit is left exposed, the encapsulant used to encapsulate the integrated circuit does not form a thermal barrier between the integrated circuit and the exterior of the package. Thus, the packaged integrated circuit is able to more efficiently conduct heat away from the integrated circuit.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.