Sample separating apparatus and method, and substrate manufacturing method
US6527031B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 5, 1999 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Nov 5, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1939
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
This invention is to provide a technique of separating bonded substrate stacks having porous layers at a high yield. A separating apparatus (100) has a pair of substrate holding portions (270, 280). A bonded substrate stack (50) is sandwiched from upper and lower sides and horizontally held by the substrate holding portions (270, 280) and rotated. A jet is ejected from a nozzle (260) and injected into the porous layer of the bonded substrate stack (50), thereby separating the bonded substrate stack (50) into two substrates at the porous layer. Another separating apparatus (5000) has a pair of substrate holding portions (270, 280), a nozzle (260) of rejecting a fluid to the porous layer of a bonded substrate stack (50), and an abrupt operation prevention mechanism (4000) for preventing the lower substrate holding portion (280) from abruptly moving downward but allowing it to moderately move when separating the bonded substrate stack (50).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.