Composition and method for planarizing surfaces
US6527817B1 · kind B1 · utility
9Cited by
22References
34Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 25, 2000 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Dec 26, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/3212
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A composition and a method for planarizing or polishing a surface with the composition are provided. The composition comprises a liquid carrier, a chemical accelerator, and solids comprising about 5-90 wt. % of fumed metal oxide, and about 10-95 wt. % of abrasive particles, wherein about 90% or more of the abrasive particles (by number) have a particle size no greater than 100 nm. The composition of the present invention is useful in planarizing or polishing a surface with high polishing efficiency, uniformity, and removal rate, with minimal defectivity, such as field loss of underlying structures and topography.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.