Patent · US Expired

Biometric sensor and method for its production

US6528723B2 · kind B2 · utility

7Cited by

6References

5Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Manfred Fries · Hunderdorf, DE
Thomas Münch · Hemau, DE
Reinhard Fischbach · Birkenfeld, DE

Key dates

Filing date	Jan 16, 2001
Grant date	Mar 4, 2003
Priority date	—
Expiry date	Jan 16, 2021

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T29/49171
WIPO fieldControl
WIPO sectorInstruments

Abstract

In a biometric sensor and a method for its production, a sensor chip is provided with connecting contacts in the form of electrically conductive bumps. The sensor chip is inserted into a chip housing, the bumps making contact with corresponding connecting leads belonging to the chip housing. At the same time as this contact is made, the sensor chip is bonded adhesively into the chip housing by an adhesive layer, which surrounds the sensor field in a sealing manner.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.