Integrated cooling system
US6529377B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Sep 5, 2001 |
| Grant date | Mar 4, 2003 |
| Priority date | — |
| Expiry date | Sep 5, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4935
- WIPO fieldPharmaceuticals
- WIPO sectorChemistry
Abstract
Systems and methods are described for integrated cooling system. A method includes: circulating a liquid inside a flexible multi-layer tape; and transporting heat between a heat source that is coupled to the flexible multi-layer tape and a heat sink that is coupled to the flexible multi-layer tape. A method includes installing a flexible multi-layer tape in an electrical system, wherein the flexible multi-layer tape includes a top layer; an intermediate, layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, the intermediate layer defining a closed loop circuit for a circulating fluid. An apparatus includes a flexible multi-layer tape, including: a top layer; an intermediate layer coupled to the top layer; and a bottom layer coupled to the intermediate layer, wherein the intermediate layer defines a closed loop circuit for a circulating fluid.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.