System for assembling substrates to bonding zones provided with cavities
US6531232B1 · kind B1 · utility
5Cited by
6References
11Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 16, 2001 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Apr 16, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12528
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
The invention relates to a system comprising a first substrate (100) with at least one bonding area (110a, 110b), liable to be assembled with a second substrate (200), the bonding area (110a, 110b) comprising an area made of a material (104) that can be wetted with a meltable material. According to the invention, the bonding area (110a, 110b) comprises at least one cavity (120) to receive meltable material.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.