Francois Baleras
13Patents
3h-index
18Co-inventors
53Inventor score
Filing activity: Apr 11, 2001 → Nov 29, 2017
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6531232B1 | System for assembling substrates to bonding zones provided with cavities | Emerging Cross-Sectional Technologies | 5 | Expired |
| US7786561B2 | Encapsulated microcomponent equipped with at least one getter | Performing Operations; Transporting | 4 | Active |
| US6909445B2 | High density element structure formed by assembly of layers and method for making same | Electricity | 3 | Expired |
| US8039285B2 | Thin film getter protection | Emerging Cross-Sectional Technologies | 2 | Active |
| US8746048B2 | Device for the gravimetric detection of particles in a fluid medium, comprising an oscillator between two fluid channels | Emerging Cross-Sectional Technologies | 1 | Active |
| US8039306B2 | 3D integration of vertical components in reconstituted substrates | Electricity | 1 | Active |
| US6835577B2 | Method for making a block for testing components | Physics | 1 | Expired |
| US7332988B2 | Frequency filter and its manufacturing process | Electricity | 1 | Expired |
| US7723854B2 | Assembly and method of assembling by soldering an object and a support | Emerging Cross-Sectional Technologies | 1 | Active |
| US10082135B2 | Method for producing at least one deformable membrane micropump and deformable membrane micropump | Emerging Cross-Sectional Technologies | 0 | Active |
| US10112827B2 | Process for producing an electromechanical device | Performing Operations; Transporting | 0 | Active |
| US8159076B2 | Method of producing a via in a reconstituted substrate | Electricity | 0 | Active |
| US8409971B2 | Integrated multicomponent device in a semiconducting die | Emerging Cross-Sectional Technologies | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.