3-D lead inspection
US6532063B1 · kind B1 · utility
5Cited by
11References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 10, 2000 |
| Grant date | Mar 11, 2003 |
| Priority date | — |
| Expiry date | Nov 10, 2020 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG01N2021/95661
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A semiconductor lead inspection device includes a camera and an illumination source for backlighting the leads of the semiconductor device to form an image in the camera. The camera and the illumination device are arranged on optical paths which alternatively pass through or are reflected by a beamsplitter. A surface is illuminated to backlight the leads and a light deflecting device is arranged for deflecting the backlit image of the semiconductor leads to form an image in the camera.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.