Plating method and apparatus that creates a differential between additive disposed on a top surface and a cavity surface of a workpiece using an external influence
US6534116B2 · kind B2 · utility
67Cited by
6References
30Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 18, 2000 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Dec 18, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/76879
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.