Cover cap for semiconductor wafer devices
US6534340B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Nov 18, 1998 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Nov 18, 2018 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2224/48227
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A cover cap for semiconductor wafer devices is disclosed. According to the invention, a wafer of material that is at least one of photo-etchable or transparent is patterned and attached as a cover to a substrate including a number of semiconductor devices. Preferably, the cover wafer is made from a photo-etchable material so that portions of the cover wafer may be selectively sensitized and etched. In particular, one or more cover caps may be defined in the cover wafer such that each cover cap corresponds to a respective device on the device substrate. Once the cover wafer is attached to the device substrate to form an assembly, the assembly is diced into individual devices and the devices are packaged. The invention provides several advantages for a number of semiconductor device fabrication applications, including those relating to image sensors, and micro-machined devices such as MEMS. For example, a cover wafer attached to the device substrate prior to dicing and packaging of individual devices provides more robust devices by protecting the device substrate from any number of environmental hazards, such as particulate contamination, moisture, processing agents such as solvents,…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.