Patent · US Expired

Method for mounting a semiconductor chip on a carrier layer and device for carrying out the method

US6534345B1 · kind B1 · utility

8Cited by

10References

5Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Simon Muff · Mering, DE
Jens Pohl · San Luis Obispo, US
Johann Winderl · Neunburg vorm Wald, DE

Key dates

Filing date	Feb 28, 2000
Grant date	Mar 18, 2003
Priority date	—
Expiry date	Feb 28, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/01082
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

In order to mount a semiconductor chip on a carrier layer, consolidated filler material is applied between the semiconductor chip and the carrier layer. The filler material is sucked, under the application of a partial vacuum, from at least one edge section of the semiconductor chip to at least one other edge section of the semiconductor chip. As a result, a package is provided in which the filler material is essentially free of air inclusions.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.