Combination circuit board and segmented conductive bus substrate
US6535396B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 28, 2000 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Apr 28, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/1053
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A combination circuit board (12) and segmented bus structure (54) defines a composite circuit board/bus assembly (52) upon which an electrical circuit may be assembled. The various segments (54a-54f) of bus structure (54) may be variously configured to achieve one or more assembly, performance, testing, and/or reliability goals. For example, one bus segment configuration provides integral connector tabs (54a and 54e) for mechanical and/or electrical connection to interconnecting wires or electrical terminals of one or more external devices. Another bus segment configuration (54d) provides for mechanical and high current electrical interconnections between one or more bus segments (54a-54f) and one or more electrical components (16, 18, 20) and/or conductive film patterns(64) formed on top surface (12b) of the circuit board (12). Still another bus segment configuration provides integral tabs (54b and 54c) for electrical connection to and mechanical attachment of electrical components (16, 18, 20) from one or more of such tabs (54b and 54c) extending through the circuit board (12) to other such tabs (54b and 54c) or other circuit structures. Yet another bus structure (54f) provides f…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.