Darrel E. Peugh
11Patents
9h-index
21Co-inventors
64Inventor score
Filing activity: Feb 27, 1998 → Mar 28, 2006
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6156980A | Flip chip on circuit board with enhanced heat dissipation and method therefor | Electricity | 75 | Expired |
| US7551439B2 | Fluid cooled electronic assembly | Electricity | 72 | Active |
| US5953814A | Process for producing flip chip circuit board assembly exhibiting enhanced reliability | Emerging Cross-Sectional Technologies | 50 | Expired |
| US7538425B2 | Power semiconductor package having integral fluid cooling | Electricity | 50 | Expired |
| US7215547B2 | Integrated cooling system for electronic devices | Electricity | 47 | Expired |
| US7365981B2 | Fluid-cooled electronic system | Electricity | 25 | Expired |
| US6535396B1 | Combination circuit board and segmented conductive bus substrate | Electricity | 19 | Expired |
| US6833628B2 | Mutli-chip module | Electricity | 17 | Expired |
| US7106588B2 | Power electronic system with passive cooling | Electricity | 9 | Expired |
| US6045032A | Method of preventing solder reflow of electrical components during wave soldering | Emerging Cross-Sectional Technologies | 7 | Expired |
| US6560110B1 | Corrosive resistant flip chip thermal management structure | Electricity | 5 | Expired |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.