Apparatus and method for endpoint control and plasma monitoring
US6535779B1 · kind B1 · utility
27Cited by
66References
40Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 6, 1998 |
| Grant date | Mar 18, 2003 |
| Priority date | — |
| Expiry date | Mar 6, 2018 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG05B2219/2602
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A substrate processing system having a bi-directional interface and concomitant communication protocol to allow a controller to communicate with an external endpoint system is disclosed. More specifically, the substrate processing system comprises a controller and an endpoint detection system that are coupled together via a RS-232 interface. A SECS compliant communication protocol is employed to effect communication between the controller and endpoint detection system to increase wafer processing information exchange and data exchange.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.