Wafer handling system
US6536131B2 · kind B2 · utility
15Cited by
4References
25Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Dec 12, 2000 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Dec 12, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/68707
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside surface of the carrier. Wafer retainers on the carrier pivot to better secure wafers within the carrier.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.