Sensor, composed of a multilayer substrate, having a spring element that is delineated out of a semiconductor layer

US6536282B1 · kind B1 · utility

Assignee

• Robert Bosch GmbH · DE

Inventors

• Andreas Kipp · Reutlingen, DE
• Joerg Hauer · Reutlingen, DE
• Markus Lutz · Palo Alto, US

Key dates

• Filing date: May 3, 2000
• Grant date: Mar 25, 2003
• Expiry date: May 3, 2020

Classification

• Technology area (CPC G): Physics
• CPC primary: G01P2015/0814
• WIPO field: Measurement
• WIPO sector: Instruments

Abstract

A sensor, composed of a multilayer substrate, having a first semiconductor layer in which at least one spring element is configured using patterning, the spring element having two arms running essentially parallel to each other and joining to each other at one end segment, the first arm being mounted on a support block and the second arm being joined to a mass that is movable with respect to the support block, in order to avoid a fracture of the spring elements in response to powerful deflections perpendicular to the semiconductor layer. The at least one spring element is configured so that the end segments of the arms in the longitudinal direction of the arms in the plane of the semiconductor layer are directed so as to be initially bent away from each other and then so as to be bent towards each other, joining each other in a central bent area.