Protection of a plated through hole from chemical attack
US6537608B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | Jan 2, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Jan 2, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/249985
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of forming an electronic structure, including adhesively coupling a plated metallic layer (e.g. a copper layer) of a plated through hole (PTH) to holefill material (e.g., epoxy resin) distributed within the PTH. The adhesive coupling utilizes an adhesion promoter film on the plated metallic layer such that the adhesion promoter film is bonded to the resin. The adhesion promoter film may include a metallic oxide layer such as a layer containing cupric oxide and cuprous oxide, which could be formed from bathing a PTH plated with copper in a solution of sodium chlorite. The adhesion promoter film may alternatively include an organometallic layer such as a layer that includes a chemical complex of metal and an organic corrosion inhibitor. The organometallic layer could be formed from bathing the PTH in a bath of hydrogen peroxide, sulfuric acid, and the organic corrosion inhibitor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.