Super thin/super thermal ball grid array package
US6537848B2 · kind B2 · utility
47Cited by
26References
13Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 30, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | May 30, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/30107
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
In a first embodiment of the invention, a copper foil is attached to a substrate, in the second embodiment of the invention a adhesive film is attached to a substrate. Processing then continues by attaching the die to the copper foil/adhesive film. After this the processing continues identically for the two embodiments of the invention, interrupted by, for the second embodiment of the invention, detaching the film and replacing the film with a copper foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.