ST ASSEMBLY TEST SERVICES LTD.
65Patents
9Active
65Granted
40Portfolio score
Filing activity: Sep 14, 1999 → Sep 28, 2011 · 8 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6420779B1 | Leadframe based chip scale package and method of producing the same | Electricity | 225 | Expired |
| US6861288B2 | Stacked semiconductor packages and method for the fabrication thereof | Electricity | 159 | Expired |
| US6599779B2 | PBGA substrate for anchoring heat sink | Electricity | 78 | Expired |
| US7005325B2 | Semiconductor package with passive device integration | Emerging Cross-Sectional Technologies | 58 | Expired |
| US7309913B2 | Stacked semiconductor packages | Electricity | 52 | Expired |
| US6534859B1 | Semiconductor package having heat sink attached to pre-molded cavities and method for creating the package | Electricity | 52 | Expired |
| US6775140B2 | Heat spreaders, heat spreader packages, and fabrication methods for use with flip chip semiconductor devices | Electricity | 50 | Expired |
| US6537848B2 | Super thin/super thermal ball grid array package | Electricity | 47 | Expired |
| US6833287B1 | System for semiconductor package with stacked dies | Electricity | 30 | Expired |
| US6479903B2 | Flip chip thermally enhanced ball grid array | Electricity | 29 | Expired |
| US7205651B2 | Thermally enhanced stacked die package and fabrication method | Electricity | 28 | Expired |
| US6630373B2 | Ground plane for exposed package | Electricity | 25 | Expired |
| US6960493B2 | Semiconductor device package | Electricity | 25 | Expired |
| US6737298B2 | Heat spreader anchoring & grounding method & thermally enhanced PBGA package using the same | Electricity | 24 | Expired |
| US6242933A | Device probe socket forming part of a test head, interfacing between test head and a probe handler, used for device strip testing | Emerging Cross-Sectional Technologies | 22 | Expired |
| US7129569B2 | Large die package structures and fabrication method therefor | Electricity | 19 | Expired |
| US6544812B1 | Single unit automated assembly of flex enhanced ball grid array packages | Electricity | 19 | Expired |
| US6858470B1 | Method for fabricating semiconductor packages, and leadframe assemblies for the fabrication thereof | Electricity | 19 | Expired |
| US6927479B2 | Method of manufacturing a semiconductor package for a die larger than a die pad | Electricity | 16 | Expired |
| US7064420B2 | Integrated circuit leadframe with ground plane | Emerging Cross-Sectional Technologies | 16 | Expired |
| US7700404B2 | Large die package structures and fabrication method therefor | Electricity | 15 | Active |
| US6627990B1 | Thermally enhanced stacked die package | Electricity | 15 | Expired |
| US6586925B2 | Method and apparatus for establishing quick and reliable connection between a semiconductor device handler plate and a semiconductor device test head plate | Physics | 14 | Expired |
| US7242101B2 | Integrated circuit die with pedestal | Electricity | 13 | Expired |
| US8035204B2 | Large die package structures and fabrication method therefor | Electricity | 12 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.