Method and apparatus for sample fabrication
US6538254B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Mar 22, 1999 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Mar 22, 2019 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S977/951
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A method and an apparatus for fabrication of a specimen including a semiconductor wafer or a semiconductor device chip and the tip of a probe firmly joined to the vicinity of an area to be observed on the specimen substrate which is mounted on a sample stage. A micro-specimen including the area to be observed is separated from the specimen substrate. Firmly joined to the tip of the probe, the micro-specimen separated from the specimen substrate is then transferred to a specimen holder of an apparatus for carrying out an observation, an analysis and/or a measurement on the micro-specimen to be fixed to the specimen holder. Subsequently, the tip of the probe is separated from the micro-specimen fixed to the specimen holder.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.