High frequency printed circuit board via
US6538538B2 · kind B2 · utility
98Cited by
9References
30Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 16, 2001 |
| Grant date | Mar 25, 2003 |
| Priority date | — |
| Expiry date | Jan 16, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10689
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A printed circuit board (PCB) via, providing a conductor extending vertically between microstrip or stripline conductors formed on separate layers of a PCB, includes a conductive pad surrounding the conductor and embedded within the PCB between those PCB layers. The pad's shunt capacitance and the magnitudes of capacitances of other portions of the via are sized relative to the conductor's inherent inductance to optimize frequency response characteristics of the via.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.