Method and device for drying substrates

US6539956B1 · kind B1 · utility

Assignee

• Steag Micro Tech GmbH · DE

Inventors

• Klaus Conrad Wolke · Althengstett, DE
• Martin Weber · Borgo San Lazzaro, DE

Key dates

• Filing date: Jul 10, 1998
• Grant date: Apr 1, 2003
• Expiry date: Jul 10, 2018

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10S134/902
• WIPO field: Semiconductors
• WIPO sector: Electrical engineering

Abstract

In a method for drying substrates, in particular, semiconductor wafers, an especially residue-free drying of the substrates results when, during removal of the substrates from a liquid, a meniscus of the liquid forming at the transition between the substrate surface and the liquid surface is heated. A device for performing the method is disclosed.