Device and method for handling individual wafers
US6540468B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Apr 17, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Apr 17, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S414/141
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
An apparatus and a method for handling individual wafers (2) that are temporarily in an essentially horizontal position. The apparatus (1) comprises at least one supporting part (5) with supporting areas (6), comprising at least three supporting points (9), for supporting an edge region of the wafer, and at least one holding part (7) with holding areas (8), comprising at least two holding points (10), for gripping the edge (4) of this wafer (2), with the holding points (10) being moveable relative to the supporting points (9) and, to grasp the wafer (2), relative to one another. Moreover, at least one of these holding points (10) is arranged on a rotatable rod (12) designed, for reliable holding of the wafer, as a holding part (7), with rod (12) extending coaxially with an axis (11) running through the wafer center (3) and essentially parallel to the surface of the wafer (2).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.