Chemical mechanical polishing apparatus and method having a rotating retaining ring
US6540590B1 · kind B1 · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 2000 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Aug 31, 2020 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB24B57/02
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A polishing apparatus (100) and method for polishing and planarizing a substrate (105) is provided that achieves a high-planarization uniformity across the substrate. In one embodiment, the polishing head (140) includes a carrier (155), a subcarrier (160) carried by the carrier and adapted to hold the substrate (105) during a polishing operation and a retaining ring (170) rotatably disposed about the subcarrier. The retaining ring (170) has a lower surface (205) that is substantially flush with the surface of the substrate (105) and is in contact with a polishing surface (125) during the polishing operation. The retaining ring (170) is capable of rotating relative to the substrate (105) held on the subcarrier (160) to inhibit non-planar polishing of the surface of the substrate. In another embodiment, the polishing head (140) further includes a backing ring (210) in a facing relationship with an upper surface (255) of the retaining ring (170) and separated from the retaining ring by a bearing (260).
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.