Method for lamination of fluoropolymer to metal and printed circuit board (PCB) substrate
US6540866B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | Jun 28, 2000 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Dec 10, 2020 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/1168
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The present invention is directed to a method for the lamination of fluoropolymers to the surfaces of metals, and especially to copper, gold, and platinum, and to printed circuit board (PCB) substrate at temperatures substantially below the sintering temperatures or melting temperatures of the fluoropolymers. More specifically, the invention is directed to a method for surface modification of fluoropolymers by thermal graft copolymerization with concurrent lamination of metals in the presence of a functional monomer and an adhesive such as an epoxy resin. The process can be carried out under atmospheric conditions and in the complete absence of an added polymerization initiator. The laminated fluoropolymer-metal or fluoropolymer-PCB substrate interfaces exhibit T-peel strengths of no less than 8 N/cm. This invention can also be applied to substantially improve the adhesion between PCB substrates and metals.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.