Method of forming termination on chip components
US6541302B2 · kind B2 · utility
8Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 11, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Jan 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01G13/006
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A method for forming terminations on the opposite ends of a chip component includes placing a chip component in a cavity with one end of the chip component exposed. Termination conductive material is then deposited on the exposed end of the chip component and the component is removed from the cavity and reversed. Termination material is then deposited on the other exposed end. One modification of the invention includes extending the chip components completely through holes in a plate so that the opposite ends of the chip component are exposed. The termination material is then placed on the opposite ends of the chip component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.