VISHAY SPRAGUE, INC.
42Patents
16Active
42Granted
39Portfolio score
Filing activity: Sep 16, 1996 → Aug 12, 2019 · 7 expiring within 5 years
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6191936A | Capacitor having textured pellet and method for making same | Electricity | 113 | Expired |
| US6238444A | Method for making tantalum chip capacitor | Emerging Cross-Sectional Technologies | 43 | Expired |
| US6380577B1 | Tantalum chip capacitor | Emerging Cross-Sectional Technologies | 41 | Expired |
| US5825611A | Doped sintered tantalum pellets with nitrogen in a capacitor | Electricity | 34 | Expired |
| US7161797B2 | Surface mount capacitor and method of making same | Emerging Cross-Sectional Technologies | 29 | Expired |
| US6447570B1 | Sintered Tantalum and Niobium capacitor pellets doped with Nitrogen, and method of making the same | Electricity | 28 | Expired |
| US7715173B2 | High voltage capacitors | Emerging Cross-Sectional Technologies | 20 | Active |
| US7449032B2 | Method of manufacturing surface mount capacitor | Emerging Cross-Sectional Technologies | 16 | Active |
| US6410083B1 | Method for doping sintered tantalum and niobium pellets with nitrogen | Electricity | 13 | Expired |
| US6148502A | Surface mount resistor and a method of making the same | Emerging Cross-Sectional Technologies | 13 | Expired |
| US6185090A | Method for doping sintered tantalum and niobium pellets with nitrogen | Electricity | 10 | Expired |
| US8028397B2 | Method of making a frame package array device | Emerging Cross-Sectional Technologies | 9 | Active |
| US6541302B2 | Method of forming termination on chip components | Electricity | 8 | Expired |
| US7221555B2 | Surface mount MELF capacitor | Electricity | 7 | Expired |
| US6212065A | Capacitor pellet and lead assembly | Electricity | 6 | Expired |
| US6184775A | Surface mount resistor | Emerging Cross-Sectional Technologies | 6 | Expired |
| US7085127B2 | Surface mount chip capacitor | Electricity | 6 | Expired |
| US9070512B2 | Electrophoretically deposited cathode capacitor | Electricity | 5 | Active |
| US6319292A | Method for making capacitor pellet and lead assembly | Electricity | 5 | Expired |
| US6914770B1 | Surface mount flipchip capacitor | Electricity | 5 | Expired |
| US7167357B2 | Surface mount MELF capacitor | Electricity | 5 | Expired |
| US10176930B2 | Low profile flat wet electrolytic tantalum capacitor | Electricity | 5 | Active |
| US8238075B2 | High voltage capacitors | Emerging Cross-Sectional Technologies | 4 | Active |
| US6483693B2 | Center molded capacitor | Emerging Cross-Sectional Technologies | 4 | Expired |
| US8125762B2 | High voltage capacitors | Emerging Cross-Sectional Technologies | 4 | Active |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.