Patent · US Expired

Method of positioning a component mounted on a lead frame in a test socket

US6541311B1 · kind B1 · utility

3Cited by

2References

4Claims

0Family size

Assignee

Infineon Technologies AG · DE

Inventors

Christian Hauser · Lappersdorf, DE
Ulrich Vidal · Landshut, DE
Harald Widner · Ingolstadt, DE

Key dates

Filing date	Oct 6, 2000
Grant date	Apr 1, 2003
Priority date	—
Expiry date	Oct 6, 2020

Classification

Technology area (CPC H)Electricity
CPC primaryH01L2924/0002
WIPO fieldSemiconductors
WIPO sectorElectrical engineering

Abstract

A lead frame is configured with conductor leads, a dam bar and an extension between the conductor leads. The extension projects from the dam bar toward a central region of the lead frame. An electronic component is mounted on the lead frame and is brought into electrical contact with inner leads. The component and the lead frame are encased by injection molding. The extension is then isolated from the rest of the lead frame and is removed from the housing body. Thus a separating face is produced between the housing body and the extension. The separating face is used as a reference when positioning the component in a test socket.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.