Bump forming method and bump forming apparatus
US6541364B2 · kind B2 · utility
Assignees
Inventors
Key dates
| Filing date | Nov 9, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Nov 9, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/3478
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A mask 11 has a plurality of holes formed at positions corresponding to positions of a plurality of electrode portions 10a on one surface of an object to be processed 10 to mount thereon conductive particles 13, and the plurality of holes are opposite to the plurality of electrode portions 10a formed on the object to be processed. A table 12 has a plurality of holes 12a for sucking the object to be processed 10 from the other surface of the object to be processed 10, and for sucking the particles 13 through the plurality of holes 11a in the mask 11 so that the particles 13 may be mounted on the electrode portions 10a formed on the object to be processed 10. A hopper 14 contains therein the plurality of conductive particles 13, prevents the plurality of conductive particles 13 from adhering to each other, and has a slit portion 17 for dropping the plurality of conductive particles 13 by the self-weight. A slit portion 17 in the hopper 14 is moved, facing the upper surface of the mask 11 with a gap between the slit portion 17 and the upper surface of the mask 11 larger than a diameter of the particle 13, and the hopper 14 is arranged in the front side in the moving direction, and the…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.