Hideki Mukuno
6Patents
4h-index
24Co-inventors
53Inventor score
Filing activity: Dec 11, 2000 → Apr 18, 2014
Most-cited inventions
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6541364B2 | Bump forming method and bump forming apparatus | Electricity | 18 | Expired |
| US6555052B2 | Electron device and semiconductor device | Emerging Cross-Sectional Technologies | 18 | Expired |
| US6761301B2 | Soldering machine | Performing Operations; Transporting | 10 | Expired |
| US6774490B2 | Electronic device | Emerging Cross-Sectional Technologies | 9 | Expired |
| US6412681B2 | Soldering machine | Performing Operations; Transporting | 4 | Expired |
| US9779976B2 | Adhesive sheet, method for manufacturing semiconductor device using same, method for manufacturing thermal airflow sensor using same, and thermal airflow sensor | Electricity | 0 | Active |
Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.