Plastic package for micromechanical devices
US6541832B2 · kind B2 · utility
113Cited by
1References
12Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jan 19, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | Jan 19, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/15311
- WIPO fieldMicro-structural and nano-technology
- WIPO sectorChemistry
Abstract
Low-cost plastic cavity-up land-grid array packages and ball-grid array packages are provided, suitable for wire-bonded chips having micromechanical components. The packages feature a thermal heat spreader and a protective lid. The package structure disclosed is flexible with regard to materials and geometrical detail, and provides solutions to specific functions such as storage space for chemical compounds within the enclosed cavity of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.