Inventor · Allen, TX, US

Anthony L. Coyle

26Patents
9h-index
17Co-inventors
68Inventor score

Filing activity: Dec 19, 1997 → Sep 10, 2013

Most-cited inventions

PatentTitleAreaCited byStatus
US6541832B2 Plastic package for micromechanical devices Electricity 113 Expired
US6518089B2 Flip chip semiconductor device in a molded chip scale package (CSP) and method of assembly Electricity 89 Expired
US6489178B2 Method of fabricating a molded package for micromechanical devices Electricity 74 Expired
US6049129A Chip size integrated circuit package Electricity 65 Expired
US7608484B2 Non-pull back pad package with an additional solder standoff Emerging Cross-Sectional Technologies 38 Active
US7026710B2 Molded package for micromechanical devices and method of fabrication Electricity 28 Expired
US7335536B2 Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices Electricity 27 Expired
US6858910B2 Method of fabricating a molded package for micromechanical devices Electricity 26 Expired
US6696757B2 Contact structure for reliable metallic interconnection Emerging Cross-Sectional Technologies 23 Expired
US7863098B2 Flip chip package with advanced electrical and thermal properties for high current designs Electricity 8 Active
US6753616B2 Flip chip semiconductor device in a molded chip scale package Electricity 6 Expired
US7256482B2 Integrated circuit chip packaging assembly Electricity 5 Expired
USRE46466E1 Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices General 4 Active
US6586676B2 Plastic chip-scale package having integrated passive components Electricity 4 Expired
US7476976B2 Flip chip package with advanced electrical and thermal properties for high current designs Electricity 3 Active
US8039956B2 High current semiconductor device system having low resistance and inductance Electricity 3 Active
US8053876B2 Multi lead frame power package Electricity 2 Active
US7084494B2 Semiconductor package having integrated metal parts for thermal enhancement Electricity 2 Expired
US6916689B2 Plastic chip-scale package having integrated passive components Electricity 2 Expired
US8232144B2 Non-pull back pad package with an additional solder standoff Emerging Cross-Sectional Technologies 2 Active
US8053285B2 Thermally enhanced single inline package (SIP) Electricity 1 Active
USRE48420E1 Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices General 0 Active
US8154117B2 High power integrated circuit device having bump pads Electricity 0 Active
US7488623B2 Integrated circuit chip packaging assembly Electricity 0 Active
USRE46618E1 Method for fabricating low resistance, low inductance interconnections in high current semiconductor devices General 0 Active

Source: USPTO / EPO open patent data. Inventor disambiguation is heuristic; counts are objective bibliographic measures.