Components with releasable leads and methods of making releasable leads
US6541845B2 · kind B2 · utility
4Cited by
14References
12Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 6, 2001 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | May 14, 2021 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/3011
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A connection component for a microelectronic device such as a semiconductor chip incorporates a support layer and conductive structures extending across a surface of the support layer. The conductive structures have anchors connecting them to the support layer, and releasable or unanchored portions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.