Heat dissipating device for a CPU
US6542370B1 · kind B1 · utility
Assignees
Inventors
Key dates
| Filing date | May 2, 2002 |
| Grant date | Apr 1, 2003 |
| Priority date | — |
| Expiry date | May 2, 2022 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/0002
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A heat dissipating device has a conductor holder and a heat conductor. The conductor holder is securely attached to the CPU base and has a through hole. The heat conductor is securely connected to the through hole in the conductor holder and contacts with the CPU. The heat conductor comprises multiple heat conductive elements made of a material with good heat conductivity. One end of the heat conductive elements are twisted together to form a bound section on the first end of the heat conductor. The other end of each heat conductive element is far away from the other element so as to form an expansion section on a second end of the heat conductor. In such an arrangement, the heat generated by the CPU can be efficiently dissipated from the expansion section of the heat conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.