Jack Wang
9Patents
0Active
9Granted
26Portfolio score
Filing activity: May 2, 2002 → Jun 21, 2004
Most-cited patents
| Patent | Title | Area | Cited by | Status |
|---|---|---|---|---|
| US6672379B1 | Positioning and buckling structure for use in a radiator | Electricity | 24 | Expired |
| US6607028B1 | Positioning structure for heat dissipating fins | Electricity | 20 | Expired |
| US7019979B2 | Heat dissipating device having improved fastening structure | Electricity | 20 | Expired |
| US7069737B2 | Water-cooling heat dissipation system | Electricity | 16 | Expired |
| US6542370B1 | Heat dissipating device for a CPU | Electricity | 12 | Expired |
| US6968889B2 | Fastening structure of heat sink | Electricity | 12 | Expired |
| US6595275B1 | Heat sink assembly | Electricity | 7 | Expired |
| US6571862B1 | Heat dissipating fin | Mechanical Engineering; Lighting; Heating | 5 | Expired |
| US7190576B2 | Internally disposed cooling device for electronic apparatus | Emerging Cross-Sectional Technologies | 4 | Expired |
Source: USPTO / EPO open patent data. Counts and citation impact are objective bibliographic measures.