Process and apparatus for applying charged particles to a substrate, process for forming a layer on a substrate, products made therefrom
US6544599B1 · kind B1 · utility
86Cited by
9References
5Claims
0Family size
Inventors
Key dates
| Filing date | Jul 31, 1996 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | Jul 31, 2016 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C16/0254
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Method and apparatus for seeding silicon substrates with diamond particles by electrostatic seeding. Method further includes either application of heat to form the particles into a layer, or chemical vapor deposition of diamond layer onto the particles. Disclosed products include silicon substrate having electrostatically affixed diamond particles, silicon substrate having particles at a density of at least 1012 particles per cm2, and silicon substrate having polycrystalline layer having nucleation density of at least 1012 particles per cm2.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.