Printed wiring board interposer sub-assembly
US6545226B2 · kind B2 · utility
Assignee
Inventors
Key dates
| Filing date | May 31, 2001 |
| Grant date | Apr 8, 2003 |
| Priority date | — |
| Expiry date | May 31, 2021 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49213
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
The details of a printed wiring board (PWB) sub-assembly and the method of producing the same are described. The sub-assembly comprises a printed circuit board electrically joined through a plurality of connections to one or more area array devices, such as modules or printed wiring boards. The sub-assembly can serve as a part of an original assembly. The sub-assembly can function as an after market item that can be readily substituted as a replacement for a failed component wherein the dimensional space between the printed circuit board and one or both of the area array devices must provide sufficient clearance for surface mounted devices.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.